Growth of nano-sized copper seed layer on TiN and TaSiN by new non-toxic electroless plating

Dept. of Chem., National Taiwan Univ.Liu, R.S.R.S.LiuYou, C.C.C.C.YouTsai, M.S.M.S.TsaiHu, S.F.S.F.HuLee, K.K.LeeLu, J.J.LuLiuRS2007-04-192018-07-102007-04-192018-07-102002-08http://ntur.lib.ntu.edu.tw//handle/246246/2007041910021104application/pdf438698 bytesapplication/pdfen-USGrowth of nano-sized copper seed layer on TiN and TaSiN by new non-toxic electroless platingjournal article10.1109/NANO.2002.1032113http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910021104/1/01032113.pdf