吳瑞北Wu, Ruey-Beei臺灣大學:電信工程學研究所張復勝Chang, Fu-ShengFu-ShengChang2010-07-012018-07-052010-07-012018-07-052009U0001-2008200902330700http://ntur.lib.ntu.edu.tw//handle/246246/188275本論文主要內容是針對多層板電源接地平面所造成的電磁干擾問題做探討。在高速數位電路中,由於許多訊號線穿層或跨槽線的情況引發接地彈跳雜訊,使電磁波在層板間來回傳播與反射,並於邊緣產生電磁輻射雜訊,即電磁干擾。本文使用空腔共振器模型與共模/差模模態輻射模型解釋多層板輻射機制,並推導出一估算兩模態輻射量差值,即最大功率抑制輻射量。為了有效抑制多層板邊緣等效磁流所造成的電磁輻射問題,本文提出利用不同接地連通柱擺放方式,如一圈連通柱擺放、兩圈連通柱平行擺放以及兩圈連通柱交錯擺放方式,比較其抑制差模模態輻射的效果,並透過解析方法,分析如何使用最低成本擺放接地連通柱達到最佳輻射抑制效果。對於一圈連通柱擺放設計,其可抑制到40dB的EMI輻射量;而兩圈接地連通柱擺放可抑制到66dB以上的EMI輻射量。最後,利用電磁模擬軟體與GHz橫向電磁波傳輸室量測驗證此設計的準確性。 This thesis focuses on the problem of Electromagnetic Interference(EMI)of Printed Circuit Board(PCB)power/ground planes, which is a crucial issue to the whole system stability in high speed digital circuit. The primary noise of power/ground planes which arises from current flowing through a via or the signal trace crossing slot lines is the ground bounce. The electromagnetic waves reflecting back and forth from edges of the substrate generate a standing wave, which gives rise to radiated emission, and is often identified as EMI. The cavity resonator model together with a new even/odd mode radiation model is proposed to explain the radiated emission mechanism. The maximum power suppression between even and odd mode radiation is derived. This thesis then employs one way of using the shorting vias to suppress the odd mode radiation resulting from the PCB edges. By analytical methods, several designing methods of shorting vias placement, including 1-column vias, 2-column parallel vias and 2-column interlacing vias are presented. EMI suppression is above 40dB and 66dB for 1-column and 2-column vias design respectively. Finally, EM simulation tool “HFSS” and GTEM Cell measurement are used to validate the accuracy of the design.致 謝 i 要 iibstract iii 錄 iv 例 vi 格 ix 格 ix一章 研究動機與簡介 1-1 研究動機 1-2 文獻回顧與探討 2-3 章節概要 5-4 貢獻 6二章 多層式電源接地平面輻射場分析 12-1 平行金屬板簡介 12-2 遠場輻射機制與電磁場分析 14-3 遠場總輻射功率分析 16三章 多層式電源接地平面共模與差模輻射分析 21-1 共模與差模模態輻射機制 21-2 共模與差模模態總輻射功率分析 21-3 平均等效角度θeff 25-4 電磁模擬與理論分析驗證 28四章 利用接地連通柱抑制電磁輻射之擺放分析 38-1 接地連通柱散射場簡介 38-2 格林函數之簡化 39-3 一圈接地連通柱擺放分析 40-4 兩圈接地連通柱擺放分析 42五章 利用接地連通柱抑制電磁輻射之擺放設計 54-1 一圈接地連通柱變數分析與擺放設計 54-2 兩圈接地連通柱變數分析與擺放設計 57-3 接地連通柱擺放設計準則 59-4 電磁模擬與GTEM量測驗證 63六章 結論與未來工作 80-1 結論 80-2 未來工作 81考文獻 822556843 bytesapplication/pdfen-US電磁干擾接地彈跳雜訊空腔共振器模型接地連通柱electromagnetic interferenceground bounceshorting viascavity resonator model多層板電源接地平面電磁干擾分析與利用接地連通柱抑制輻射雜訊之設計EMI Analysis of Multilayer PCB Power/Ground Planes and Radiation Suppression Design by Shorting Viasthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/188275/1/ntu-98-R96942001-1.pdf