Lin, Yu ChienYu ChienLinDhawan, UdeshUdeshDhawanLiu, Yen ChenYen ChenLiuYUEH-LIEN LEELiu, XinkeXinkeLiuHUNG-WEI YENHu, Chih ChienChih ChienHuChung, Ren JeiRen JeiChung2024-03-012024-03-012024-03-1502578972https://scholars.lib.ntu.edu.tw/handle/123456789/640110Post-implant inflammation is a leading factor in the failure of orthopedic implant surgery. Hydrogen therapy is viewed as a medium capable of reducing reactive oxygen species (ROS) to alleviate inflammatory responses. However, existing hydrogen therapy methods have limitations, often involving undesired inhalation, injection, or non-targeted exposure of hydrogen to the body. To address this, the concept of delivering hydrogen precisely using the implant itself has been conducted in this study. Traditional hydrogen treatments for metallic implant materials, such as 316 L stainless steel (316 L SS), can induce hydrogen embrittlement (HE), significantly restricting the potential applications of hydrogenated implants in the biomedical field. Therefore, in this study, the electrochemical cathodic hydrogen charging method was employed to diffuse a hydrogenated layer of approximately 216 ± 31 nm on the surface of 316 L SS. This renders the material minimized by HE and alters its surface properties. Through in vitro and in vivo experiments, an approximately 80 % free radical scavenging rate was achieved. Additionally, significant anti-inflammatory effects were observed in the histological analysis of Femur implantation. This demonstrates that the surface hydrogenation treatment can impart anti-inflammatory properties to metallic implant materials without compromising their inherent material properties, thereby enhancing the success rate of surgical procedures.Bone implants | Electrochemical hydrogen charging | Hydrogen therapy | Reactive oxygen species (ROS) | Stainless steel[SDGs]SDG3Electrochemical hydrogen charging treatment for hydrogenated 316 L stainless steel induced hydrogen therapy for orthopedic implantationjournal article10.1016/j.surfcoat.2024.1304992-s2.0-85184136248https://api.elsevier.com/content/abstract/scopus_id/85184136248