Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Chiu, M. Y.M. Y.ChiuWang, S. S.S. S.WangChuang, T. H.T. H.Chuang2009-01-062018-06-282009-01-062018-06-282002http://ntur.lib.ntu.edu.tw//handle/246246/95930application/pdf485800 bytesapplication/pdfen-USIntermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substratesjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95930/1/71.pdf