Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Shiau, L. C.L. C.ShiauHo, C. E.C. E.HoKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-282002-03http://ntur.lib.ntu.edu.tw//handle/246246/198844en-USReactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packagesjournal article