Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates

Chiu, M.Y.M.Y.ChiuChang, S.Y.S.Y.ChangTseng, Y.H.Y.H.TsengChan, Y.C.Y.C.ChanChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122002https://scholars.lib.ntu.edu.tw/handle/123456789/492037Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substratesjournal article10.3139/146.0202482-s2.0-0036500638https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036500638&doi=10.3139%2f146.020248&partnerID=40&md5=fce1923715bca6bbf58b26cbf5f3f556