Chen, W.M.W.M.ChenKang, S.K.S.K.KangC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282012https://www.scopus.com/record/display.uri?eid=2-s2.0-84862825280&origin=resultslist&sort=plf-f&src=s&sid=8cb953b3aa70a701e586a8160ace9e85&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effects+of+Ti+addition+to+Sn%E2%80%93Ag+and+Sn%E2%80%93Cu+solders%29&sl=64&sessionSearchId=8cb953b3aa70a701e586a8160ace9e85&relpos=9en-USEffects of Ti addition to Sn–Ag and Sn–Cu soldersjournal article10.1016/j.jallcom.2012.01.0322-s2.0-84862825280http://ntur.lib.ntu.edu.tw/bitstream/246246/243599/-1/39.pdf