The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)

M. H.LiaoG.-H. LiuM.-Y. YuC.-H. ChenC.-X. Hong2019-03-112019-03-1120132158-3226https://scholars.lib.ntu.edu.tw/handle/123456789/404559The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)journal article10.1063/1.48194672-s2.0-84883875907