Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

Lin, W.H.W.H.LinWu, A.T.A.T.WuLin, S.Z.S.Z.LinChuang, T.H.T.H.ChuangTu, K.N.K.N.TuTUNG-HAN CHUANG2020-05-122020-05-122007https://scholars.lib.ntu.edu.tw/handle/123456789/492006Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper padsjournal article10.1007/s11664-007-0139-z2-s2.0-34547456938https://www.scopus.com/inward/record.uri?eid=2-s2.0-34547456938&doi=10.1007%2fs11664-007-0139-z&partnerID=40&md5=2b41c544586c9b0866d221808ff2a382