應用於3D-IC並使用垂直耦合電感之晶片間的高速無線連接

盧信嘉臺灣大學:電子工程學研究所潘俊Pan, ChunChunPan2010-07-142018-07-102010-07-142018-07-102009U0001-1408200914290500http://ntur.lib.ntu.edu.tw//handle/246246/189268本篇論文提出一個使用了耦合電感於三維積體電路的晶片間連接。跟電容耦合相比，電感耦合的連接有比較遠的通訊距離，我設計的距離是15 微米。較長的通訊距離意味著有較能抵抗製程上對不準的現象，而且我們使用交錯式的電感可以更進一步的克服這個問題。我們使用振幅偏移調變技術來達到信號完整的傳送。發射器包含鎖相迴路作為本地震盪器並使用電晶體開關作為被動混波器，接收器則包含了整流器來解調訊號並使用限制器放大訊號。本連接方法操作在6Gbps 時能達到4.08pJ/bit 能量效率。此無線連接使用台灣積體電路公司0.18 微米製程來驗證此電路架構。A wireless interconnect for 3D-IC applications is implemented by using coupled inductor design. Inductive coupling interconnect has longer communication distance asompared with capacitive interconnect. Our communication distance is 15µm. The longer distance means that it can resist the alignment mismatches and increase the yields forackaging. We also use a mis-alignment resistance coupled inductor to alleviate the alignment problem. We use ASK modulation technique to transmit the data. In transmitter,a PLL is used as the local oscillator, and switch is used as a passive mixer. In receiver,rectifiers are used to demodulate received signal, and cascaded limiters amplify the signal.This interconnect has energy efficiency of 4.08pJ/bit at 6Gbps. The proposed wireless interconnect is implemented in TSMC 0.18µm process for demonstration of this architecture.目錄 1 章簡介 ........................................................................................................ 1.1 動機 ........................................................................................................ 1.2 什麼是三維積體電路 ............................................................................ 3.2.1 封裝堆疊 .......................................................................................... 3.2.2 晶片堆疊 .......................................................................................... 4.2.3 晶圓堆疊 .......................................................................................... 4.3 已知的垂直傳輸技術 ............................................................................ 6.3.1 直通矽晶穿孔（through silicon via，TSV） .................................. 6.3.2 無線電容耦合 .................................................................................. 7.3.3 無線電感耦合 .................................................................................. 7.4 各章節簡介 ............................................................................................ 8 2 章無線垂直傳輸 ........................................................................................ 9.1 簡介 ........................................................................................................ 9.2 調變和非調變的頻譜 ............................................................................ 9.2.1 雙旁波帶和單旁波帶調變 .............................................................. 9.2.2 振幅調變和角度調變 .................................................................... 12.2.3 數位調變(Digital modulation) ....................................................... 12.2.4 歸零和不歸零訊號的頻譜 ............................................................ 13.2.5 幅移鍵控調變的頻譜 .................................................................... 17.3 現行的無線傳輸技術 .......................................................................... 18.3.1 基頻傳輸(Baseband transmission) ................................................. 18.3.2 幅移鍵控調變傳輸 ........................................................................ 21.3.3 以往的設計方法 ............................................................................ 22 3 章無線連接設計 ...................................................................................... 24.1 幅移鍵控調變的電感耦合連接 .......................................................... 24.2 通道設計 .............................................................................................. 25.2.1 無線寬頻通道實現 ........................................................................ 25.2.2 對不準問題的改善 ........................................................................ 36.3 發射端(transmitter)和接收端(receiver)電路 ....................................... 45.3.1 發射端電路 .................................................................................... 45.3.2 接收端電路 .................................................................................... 56.4 佈局圖 .................................................................................................. 60 4 章效能和量測 .......................................................................................... 62.1 抖動和眼圖 .......................................................................................... 62.2 模擬結果 .............................................................................................. 68.3 量測步驟 .............................................................................................. 70.3.1 發射端量測步驟 ............................................................................ 70.3.2 接收端量測 .................................................................................... 70.3.3 無線連接量測 ................................................................................ 70.4 [19]的晶片的量測結果 ....................................................................... 71i.4.1 發射端電路量測結果 .................................................................... 71.4.2 接收端電路量測結果 .................................................................... 73 5 章結論 ...................................................................................................... 75amp;#63851;考文獻 .................................................................................................................. 783939395 bytesapplication/pdfen-US高速無線連接3D IC[SDGs]SDG7應用於3D-IC並使用垂直耦合電感之晶片間的高速無線連接High speed wireless inter-chip signal interconnect using vertical coupled inductors for 3D-IC applicationsthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/189268/1/ntu-98-R96943126-1.pdf