Shen, P.-Z.P.-Z.ShenLin, D.-B.D.-B.LinLin, Z.-H.Z.-H.LinWu, K.-H.K.-H.WuFang, L.-C.L.-C.FangYang, C.-S.C.-S.YangChou, C.-W.C.-W.ChouPan, C.-L.C.-L.PanLin, C.-T.C.-T.LinLin, J.-C.J.-C.LinHSI-TSENG CHOU2021-05-052021-05-052020https://www.scopus.com/inward/record.url?eid=2-s2.0-85090297309&partnerID=40&md5=5bec330efd5216f733801db5391f8fc1https://scholars.lib.ntu.edu.tw/handle/123456789/558935In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 × 4 and 6 × 6 microstrip antenna elements on the stacked substrates of conventional system-in-package process to realize the desired gains for 5G applications. Within a 19 × 19 mm2 area, we are able to achieve -10 dB reflection coefficient bands of 24.25-29.5 and 37-43.5 GHz by simulations for the two most popular 5G frequency bands, where the simulated gains are 13.7 and 15.22 dBi, respectively. The beam scan range is up to ±40o. On the other hand, the CPE AiP is designed on a 33 × 33 mm2 area, where the maximum gains are 18.83 and 21.25dBi at 28 and 39 GHz, respectively. © 2020 IEEE.Active antenna subsystem; antenna in package; microstrip patch antenna; millimeter-wave frequencies; system in packageAntenna radiation; Microstrip antennas; Microwave antennas; Millimeter waves; Network components; Steerable antennas; System-in-package; Active antennas; Conventional systems; Customer premises equipment; G-frequency band; Millimeter wave frequencies; Millimeter-wave applications; System-in-packaging; User equipments; 5G mobile communication systemsconference paper10.1109/ECTC32862.2020.001042-s2.0-85090297309