Wei-Min WuMing-Che YuCHUN-HSING LIChien-Nan Kuo2020-08-052020-08-052015https://www.scopus.com/inward/record.uri?eid=2-s2.0-84962787208&doi=10.1109%2fRFIT.2015.7377878&partnerID=40&md5=dbaafc0f3f6c98ee8bbcb220ae7d3e48This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm CMOS chip to a Glass-Integrated-Passive-Device (GIPD) carrier is designed to verify the idea. Measured results of three samples show that the insertion loss and return loss can be better than 3 dB and 11.2 dB from DC up to 92 GHz. © 2015 IEEE.Bondwire; Broadband; Chip-to-chip and chip-to-carrier communications; Low-cost[SDGs]SDG7Carrier communication; Costs; Radio waves; Bondwire; Broadband; Chip to chips; Ground connections; Integrated passive device; Interconnect structures; Low costs; Measured results; Integrated circuit interconnectsconference paper10.1109/rfit.2015.73778782-s2.0-84962787208