Seymour J.P.Elkasabi Y.M.Chen H.-Y.Lahann J.Kipke D.R.2019-05-222019-05-22200901429612https://scholars.lib.ntu.edu.tw/handle/123456789/409869Parylene-C (poly-chloro-p-xylylene) is an appropriate material for use in an implantable, microfabricated device. It is hydrophobic, conformally deposited, has a low dielectric constant, and superb biocompatibility. Yet for many bioelectrical applications, its poor wet adhesion may be an impassable shortcoming. This research contrasts parylene-C and poly(p-xylylene) functionalized with reactive group X (PPX-X) layers using long-term electrical soak and adhesion tests. The reactive parylene was made of complementary derivatives having aldehyde and aminomethyl side groups (PPX-CHO and PPX-CH2NH2 respectively). These functional groups have previously been shown to covalently react together after heating. Electrical testing was conducted in saline at 37 ¢XC on interdigitated electrodes with either parylene-C or reactive parylene as the metal layer interface. Results showed that reactive parylene devices maintained the highest impedance. Heat-treated PPX-X device impedance was 800% greater at 10 kHz and 70% greater at 1 Hz relative to heated parylene-C controls after 60 days. Heat treatment proved to be critical for maintaining high impedance of both parylene-C and the reactive parylene. Adhesion measurements showed improved wet metal adhesion for PPX-X, which corresponds well with its excellent high frequency performance. ? 2009 Elsevier Ltd. All rights reserved.AdhesionElectrochemistryElectronic materialMicromachiningNeural prosthesisParyleneThe insulation performance of reactive parylene films in implantable electronic devicesjournal article10.1016/j.biomaterials.2009.07.0612-s2.0-69649086628https://www.scopus.com/inward/record.uri?eid=2-s2.0-69649086628&doi=10.1016%2fj.biomaterials.2009.07.061&partnerID=40&md5=566fe184ad948ed6c5a8f8c15154f00b