Characterization of thin films and intermetallic compounds in solder joint

Tsai, I.I.TsaiTai, L.J.L.J.TaiYen, S.F.S.F.YenChuang, T.H.T.H.ChuangLo, R.R.LoKu, T.T.KuWu, E.E.WuTUNG-HAN CHUANG2020-05-122020-05-122005https://scholars.lib.ntu.edu.tw/handle/123456789/492017Characterization of thin films and intermetallic compounds in solder jointconference paper10.1109/ESIME.2005.15028922-s2.0-33745698065https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745698065&doi=10.1109%2fESIME.2005.1502892&partnerID=40&md5=2f4f7d6ff9288a3f45dfdfc9cfed3d45