Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

Chuang, T.-H.T.-H.ChuangYen, S.-F.S.-F.YenWu, H.-M.H.-M.WuTUNG-HAN CHUANG2020-05-122020-05-122006https://scholars.lib.ntu.edu.tw/handle/123456789/492009Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finishconference paper10.1007/BF026924512-s2.0-33644924058https://www.scopus.com/inward/record.uri?eid=2-s2.0-33644924058&doi=10.1007%2fBF02692451&partnerID=40&md5=9fe5261799efaf25dc7a30e66fb2fe9c