Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode

Yang, C.L.C.L.YangLai, H.J.H.J.LaiHwang, J.D.J.D.HwangTUNG-HAN CHUANG2020-05-122020-05-122013https://scholars.lib.ntu.edu.tw/handle/123456789/491979Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodeconference paper10.1007/s11665-013-0487-12-s2.0-84879500495https://www.scopus.com/inward/record.uri?eid=2-s2.0-84879500495&doi=10.1007%2fs11665-013-0487-1&partnerID=40&md5=8e40bbf35374fb5d4d2df7a0f7e165a6