Fatigue life and reliability prediction of electronic packages under thermal cycling conditions through FEM analysis and acceleration models

Huang X.Wu W.-F.Chou P.-L.2019-07-242019-07-2420129781467349444https://www.scopus.com/inward/record.uri?eid=2-s2.0-84880312400&doi=10.1109%2fEMAP.2012.6507914&partnerID=40&md5=e4269152e84dca02b321336ff46967b3https://scholars.lib.ntu.edu.tw/handle/123456789/415013Fatigue life and reliability prediction of electronic packages under thermal cycling conditions through FEM analysis and acceleration modelsconference paper10.1109/EMAP.2012.65079142-s2.0-84880312400