Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Shiau L.C.Ho C.E.C. ROBERT KAO2019-11-272019-11-27200209540911https://www.scopus.com/inward/record.uri?eid=2-s2.0-18644381608&doi=10.1108%2f09540910210444692&partnerID=40&md5=dd7e6e794a399ca5990cb790c95b17b2https://scholars.lib.ntu.edu.tw/handle/123456789/432727Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesconference paper10.1108/095409102104446922-s2.0-18644381608