Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints

Tsai M.-Y.Lin Y.-L.C. ROBERT KAO2019-11-272019-11-2720099781424443413https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950817985&doi=10.1109%2fIMPACT.2009.5382212&partnerID=40&md5=a4bcc74f1250cf63580bb92d08b26b89https://scholars.lib.ntu.edu.tw/handle/123456789/432672Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder jointsconference paper10.1109/IMPACT.2009.53822122-s2.0-77950817985