Lai Y.Chang H.Kao C.C. ROBERT KAO2019-11-272019-11-27200909540911https://www.scopus.com/inward/record.uri?eid=2-s2.0-68249085881&doi=10.1108%2f09540910910970358&partnerID=40&md5=3aae624f43d7dafe3d9b03813e6f3c80https://scholars.lib.ntu.edu.tw/handle/123456789/432677Effect of multiple reflow cycles on ball impact responses of SnAgCu solder jointsjournal article10.1108/095409109109703582-s2.0-68249085881