Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method

Lin, C.-C.C.-C.LinYoung, H.-T.H.-T.YoungTang, C.-W.C.-W.TangTsai, M.-Y.M.-Y.TsaiHONG-TSU YOUNG2018-09-102018-09-102011http://www.scopus.com/inward/record.url?eid=2-s2.0-84863126927&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/363607Enhancing fracture strength of thinned silicon dies by a hybrid micromachining methodjournal article10.1504/IJAT.2011.044503