Huang H.-SLiao Y.-C.YING-CHIH LIAO2022-03-222022-03-22202100218995https://www.scopus.com/inward/record.uri?eid=2-s2.0-85121642961&doi=10.1002%2fapp.52070&partnerID=40&md5=03b7c493bae2e18c2b0b479305b17bc9https://scholars.lib.ntu.edu.tw/handle/123456789/598276Digital light processing 3D printing has been rapidly evolving conventional manufacturing industry with the most meticulous resolution and strongest layer-to-layer adhesion among all additive manufacturing techniques. In this study, to improve poor polymer thermal stability and dielectric properties from prevailing methyl methacrylate-based resin, tri-functional trimethylolpropane tri-acrylate (TMPTA) is introduced to form a stable polymer network. Meanwhile, monomers carrying non-polar, bulky adamantane are added to eradicate poly-TMPTA's notorious high cracking and warping tendency. Test results showed both high 1-adamantyl methacrylate and 1, 3-adamantyl di-acrylate (ADDA) additions can print crack-free samples. However, only ADDA addition keeps low CTE (82.86 ppm/oC, 200 ~ 260°C) and cuts down Df (0.02, 10 GHz). TMPTA polymer network modifications of both additions are explored. By contrast, poly-MMA exhibits much higher CTE (323.44 ppm/oC) and Df (0.035). A 3D-printed curvilinear circuit board from above resin formulation with electroplated copper circuits successfully passes lead-free level reflow without deformation. ? 2021 Wiley Periodicals LLC.blendsdielectric propertiesmanufacturingphotopolymerizationthermal properties3D printersAcrylic monomersEstersPhotopolymerizationResinsAcrylate polymersBlendDielectrics propertyDigital light processingPhoto polymerizationPhotocurablePolymer networksPrinted electronicsThermal and dielectric propertiesTrimethylolpropaneDielectric properties[SDGs]SDG9journal article10.1002/app.520702-s2.0-85121642961