2018-11-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/683445摘要：鑒於我國在半導體製程自動化光學檢測(AOI)設備自製與關鍵量測技術之重要性日 愈升高，半導體產業對於光學檢測之需求與日俱增，唯國內目前仍缺乏半導體製程 自主性線上AOI檢測設備，大部分的設備均仰賴國外進口，這對國家半導體產業的 長期發展形成隱憂。因此，本產學計畫將結合國內在AOI設備研製領域享有盛譽的 致茂電子公司組成一個半導體製程自動化光學檢測(AOI)設備的研發團隊，針對國 內AOI設備的使用者台積電、日月光以及矽品(Users)的檢測需求，開發創新性光學 檢測探頭與關鍵軟體演算技術。本三年期開發型產學合作案將針對半導體微凸塊 (micro bumps)在封裝前(Pre-bond)所需進行關鍵尺寸(Critical dimension, 包含微凸 塊之高度以及共面度)自動化光學檢測，開發創新性線上光學檢測探頭與量測關鍵 演算技術。本計畫將針對現行光學共焦顯微原理之技術缺點與限制，主要在於無法 滿足線上製程之嚴峻檢測速度以及精度的要求，積極發展創新性的光學共焦顯微量 測與掃描原理，建立有利的智慧財產權與專利佈局，以突破目前所面臨的瓶頸。 本計畫將於兩年計劃期間發展具微型化面掃描(area-scan)能力的光學量測探頭(雛 形)與所需的關鍵演算技術，在兩年期計畫所預期達成的光學檢測規格與軟體演算 功能如下： • Measurement range (depth): 20-100 µm • Lateral resolution: defined by microscopic objectives and optical diffraction limit of the microscopic objectives. • Repeatability (3σ) of depth measurement: 0.5 µm (guided by ISO standards) • Measurement frequency: >=0.26 WPH (wafers per hour) (the best in the world)<br> Abstract: Semiconductor industry plays an important role to Taiwan economy. To strengthen and advance its position in the world semiconductor industry, Taiwan chip fabrication and IC packaging companies, such as TSMC, ASE group and Siliconware precision industries need to develop the self-own key equipment and technologies to strengthen its business competitiveness. However, most of the various kind of AOI fabrication and inspection equipment used in Taiwan semiconductor manufacturing processes are currently exported from US, Japan and Israel. This will lead to a significant problem to the long term development of the country business. Thus, this university-industrial cooperative project is proposed to integrate the AOI lab in NTU with Chroma ATE Inc. (one of the leading major AOI makers in Taiwan) to form a strong R&D alley and work on the rapid development of innovative microscopic full-field profilometric system and key measuring techniques required for automated optical inspection (AOI) on semiconductor micro bumps, which have been considered as a key component. The project aims to develop key techniques in optical probe design and implementation as well as the software algorithms required to evaluate and characterize the tested bump and its associated defects. The intellectual properties of the developed project outcome will be filed and protected to form the patent deployment and licensing. The measuring optical prototype probes and processing techniques are developed to achieve the following measuring specification, in order to fulfil the strict requirements in in-line operations. • Measurement range (depth): 20-100 µm. • Lateral resolution: defined by microscopic objectives and optical diffraction limit of the microscopic objectives.自動化光學檢測 (AOI)光學量測形貌量測半導體製程共焦顯微術Automated optical inspection (AOI)optical measurementsurface profilometrysemiconductor manufacturing processesconfocal microscopy創新式光學共焦微凸塊三維全域形貌量測系統與關鍵技術之研發(2/2)