Chuang, T. H.T. H.ChuangHuang, K. W.K. W.HuangLin, W. H.W. H.LinChuangTH2009-01-062018-06-282009-01-062018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/95946application/pdf2185774 bytesapplication/pdfen-USMechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactionsjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95946/1/88.pdf