Use of a Ni interlayer to improve the thermal cycling reliability of Cu/sapphire bilayers

Lee, S.-K.S.-K.LeeTuan, W.-H.W.-H.TuanYang, T.-J.T.-J.YangWEI-HSING TUAN2020-05-122020-05-122015https://scholars.lib.ntu.edu.tw/handle/123456789/492164Use of a Ni interlayer to improve the thermal cycling reliability of Cu/sapphire bilayersjournal article10.1111/ijac.122472-s2.0-84928356087https://www.scopus.com/inward/record.uri?eid=2-s2.0-84928356087&doi=10.1111%2fijac.12247&partnerID=40&md5=550dd8b8fee73dd929db9777802a0ed1