A compact analytic model of the strain field induced by through silicon vias

CHEE-WEE LIUJan, S.-R.S.-R.JanChou, T.-P.T.-P.ChouYeh, C.-Y.C.-Y.YehLiu, C.W.C.W.LiuGoldstein, R.V.R.V.GoldsteinGorodtsov, V.A.V.A.GorodtsovShushpannikov, P.S.P.S.ShushpannikovCHEE-WEE LIU2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84862804253&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/372794A compact analytic model of the strain field induced by through silicon viasjournal article10.1109/TED.2011.2180534