Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering

Ho, C. E.C. E.HoChen, Y. M.Y. M.ChenKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-281999-11http://ntur.lib.ntu.edu.tw//handle/246246/198886en-USReaction kinetics of the solder-balls with pads in BGA packages during reflow solderingjournal article