Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems

Yang S.C.C. ROBERT KAO2019-11-272019-11-2720071424409853978142440985305695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-35348866707&doi=10.1109%2fECTC.2007.374045&partnerID=40&md5=6ca4c7b217d1e77ac9d6c47124804524https://scholars.lib.ntu.edu.tw/handle/123456789/432695Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systemsconference paper10.1109/ECTC.2007.3740452-s2.0-35348866707