2023-01-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/695959低溫成長奈米碳管對於三維封裝導線有很好的效果, 本計畫目標在於研究低溫奈米碳管的材料特性, 並藉由模擬的方式找出他對於封裝技術中最有效的應用. Low temperature Carbon Nano-tubes (CNTs) growth technology is developed in this work with the insert of Al (Aluminum) between Ni (Nickel) and Ti (Titanium) as the reactant. The optimized Al thicknesses are also investigated. CNTs growth at the low temperature below 400 °C is the key factor for the Back End of Line (BEoL) compatible process integration. In this work, we grow the CNTs by thermal chemical vapor deposition (TCVD) process at both 350 °C and 400 °C. The low ratio of peak ID/IG in Raman spectra and Scanning Electron Microscope (SEM) images proves the CNTs material quality. On the other hand, the high thermal conductivity (k) value of ~50 Wm-1K-1 is also demonstrated. Both high material quality and k value on our low temperature grown CNTs show promising opportunities for the integration of semiconductor 3D packages and Power-via related applications.封裝技術; 奈米碳管;Package Technology; Carbon Nanotube