Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration

Lu, H.-C.H.-C.LuKuo, C.-C.C.-C.KuoLin, P.-A.P.-A.LinTai, C.-F.C.-F.TaiChang, Y.-L.Y.-L.ChangJiang, Y.-S.Y.-S.JiangTsai, J.-H.J.-H.TsaiHsin, Y.-M.Y.-M.HsinHSIN-CHIA LUHUEI WANG2020-06-042020-06-042012https://scholars.lib.ntu.edu.tw/handle/123456789/497593Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integrationjournal article10.1109/TMTT.2011.21767472-s2.0-84862796727https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862796727&doi=10.1109%2fTMTT.2011.2176747&partnerID=40&md5=9c91815c39caa5c4f4a4bf5ddc7f9234