The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate

Shiue, R.K.R.K.ShiueTsay, L.W.L.W.TsayLin, C.L.C.L.LinREN-KAE SHIUE2020-05-122020-05-122003https://scholars.lib.ntu.edu.tw/handle/123456789/491909The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrateconference paper10.1016/S0026-2714(02)00259-72-s2.0-0037370335https://www.scopus.com/inward/record.uri?eid=2-s2.0-0037370335&doi=10.1016%2fS0026-2714%2802%2900259-7&partnerID=40&md5=342369001044cf8d5c029f043fd2d7eb