Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Ho, C. E.C. E.HoTsai, S. Y.S. Y.TsaiKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-282001-11http://ntur.lib.ntu.edu.tw//handle/246246/198826en-USReaction of solder with Ni/Au metallization for electronic packages during reflow solderingjournal article