Lin, Y. H.Y. H.LinTsai, C. M.C. M.TsaiHu, Y. C.Y. C.HuLin, Y. L.Y. L.LinTsai, J. Y.J. Y.TsaiKao, C. R.C. R.KaoC. ROBERT KAO2020-05-122020-05-122005978-0-87849-960-1https://scholars.lib.ntu.edu.tw/handle/123456789/490991https://www.scopus.com/inward/record.uri?eid=2-s2.0-17044413733&doi=10.4028%2f0-87849-960-1.2655&partnerID=40&md5=934b79803537611c422e39ac33d79bbeElectromigration induced metal dissolution in flip-chip solder jointsbook part10.4028/0-87849-960-1.2655WOS:000227494703032