Local melting induced by electromigration in flip-chip solder joints

Tsai C.M.Lin Y.L.Tsai J.Y.Lai Y.I.-S.C. ROBERT KAO2019-11-272019-11-27200603615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745065485&doi=10.1007%2fBF02692560&partnerID=40&md5=79ca49cef79cf29b443c2d8f8d1f1af8https://scholars.lib.ntu.edu.tw/handle/123456789/432706Local melting induced by electromigration in flip-chip solder jointsconference paper10.1007/BF026925602-s2.0-33745065485