Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages

Lin Y.L.Tsai J.C. ROBERT KAO2019-11-272019-11-272002078037682X9780780376823https://www.scopus.com/inward/record.uri?eid=2-s2.0-45449117403&doi=10.1109%2fEMAP.2002.1188859&partnerID=40&md5=13ccdaefa49852a2924a8d17cf063067https://scholars.lib.ntu.edu.tw/handle/123456789/432733Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packagesconference paper10.1109/EMAP.2002.11888592-s2.0-45449117403