Luo, W. C.W. C.LuoHo, C. E.C. E.HoTsai, J. Y.J. Y.TsaiLin, Y. L.Y. L.LinKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-282005-04http://ntur.lib.ntu.edu.tw//handle/246246/198769en-USSolid-state reactions between Ni and tin-silver-copper solders with different Cu concentrationsjournal article