2017-11-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/703962摘要：印刷電路板廣泛應用於資訊、通訊、汽車、半導體等電子產品。覆蓋膜主要應用於軟/硬式印刷電路板、IC載板和其他硬板等精密外層之線路保護。其中，感光顯影型覆蓋膜更是近年來的主流，以感光顯影的方式做出 成型孔或開出窗位露出焊點，不需要用模具沖切，因此精度更高，成本更低，製程時效更高。聚醯亞胺為傳統高性能高分子，具有優&#63868;熱機械性質，已經大量被使用在此產業中。近&#63886;&#63789;由於可撓式及穿戴式裝置蓬勃發展，聚醯亞胺由於其可撓曲性，更是被看好應用於軟性電路覆蓋膜的材料之一。然而，此材料的黏著性較差，限制其發展性。因此，印刷電路板行業正在尋找新的方式，期望可以開發出低成本、製成簡單、可工業化大量生產並有良好接著性的感光顯影型覆蓋膜之材料。 為了滿足這種需求，我們希望透過結合台大及長春人造樹脂團隊之研究能量，開發新的感光顯影型覆蓋膜結構組成，兩年研究計畫目標如下所述：(1)使用由長春公司具有環氧末端基及主鏈含柔軟雙酚A之環氧樹脂高分子，利用官能基團改質的方式，導入感光基團作為接著層，並加上感光型芳香族聚醯亞胺，調整其高分子配方制備出雙層顯影型覆蓋膜。(2)利用導入具有羥基在主鏈的芳香族聚醯亞胺，增加其接著性，調整其高分子配方制備出單層顯影型覆蓋膜。 (3)建立(1)和(2) 顯影型覆蓋膜結構製程加工效能最適化條件，並鑑定其圖案化性質及各項物理性質。長春並將配合本計畫進行後續試量產及商業化製程。 <br> Abstract: Printed circuit boards are mainly used in products of information technology, communications, automobiles, semiconductors, consumer electronics, etc. Cover layer is mainly utilized for circuit protection on the outer layer of flexible/rigid printed circuit boards, IC substrates and other rigid boards. Photo-imageable cover layer is popular recently due to its low production cost, high precision and efficient processing. Polyimides have been widely recognized as high-performance functional materials for the applications in printed circuit boards industry because of its excellent thermal and mechanical properties. In recent years, the rapid growth of the wearable devices has a high demand for flexible photosensitive imageable cover layer. Polyimides, exhibiting high flexibility, have potential to be applied in this field. However, the poor adhesion of polyimides restricts their commercial application. Therefore, new photosensitive imageable cover layer materials with the advantages of low cost, simple processing steps, and suitable for mass production with a favorable adhesion in printed circuit boards industry are designed. To meet this demand, we propose to develop new photosensitive imageable cover layer through the research team of NTU and Chang Chun Plastics. In the two-year proposed project, the following issues will be developed: (1) The synthesis of adhesion layer materials through commercial available products from Chang Chun Plastics Co., including bisphenol A and multi epoxy groups on main chain. The epoxy group on the polymer chain can be modified to vinyl groups, and then coating a photosensitive polyimide layer on it to obtain double-layer cover materials. (2) A single-layer photosensitive polyimide cover layer was prepared through introducing hydroxyl group into its main chain to refine the adhesion. (3) We will optimize the photosensitive imageable cover layer of (1) and (2) through processing condition and verification of chemical structures and correlate structural property relationship to establish the guideline for designing the photosensitive imageable cover layer for advanced printed circuit board applications. Chang Chun Plastics Co. will follow up with mass production and commercialization of the developed product.