The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

Chen W.M.Yang T.L.Chung C.K.C. ROBERT KAO2019-11-272019-11-27201113596462https://www.scopus.com/inward/record.uri?eid=2-s2.0-79958191484&doi=10.1016%2fj.scriptamat.2011.04.034&partnerID=40&md5=b28fc8bb07988b7cd6578c61c3774228https://scholars.lib.ntu.edu.tw/handle/123456789/432645The orientation relationship between Ni and Cu6Sn5 formed during the soldering reactionjournal article10.1016/j.scriptamat.2011.04.0342-s2.0-79958191484