2017-02-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/701429摘要：高可靠度熱電模組封裝技術 本研究針對中鋼公司將熱電材料應用於中低溫工業廢熱回收之模組可靠度提升，目前採用軟銲接合製作熱電模組封裝，其缺點在於熱電操作溫度受限於銲錫合金的熔點，同時銲錫與電極接合界面反應將導致熱電模組可靠度劣化，本計畫採用「固液擴散接合技術」 作為熱電模組封裝方法，此技術主要原理是利用一低熔點金屬薄膜(Sn、In、In49Sn)與鍍Ag之熱電元件及電極在較低接合溫度快速反應生成高熔點的 Ag3Sn介金屬層(480℃)，低熔點金屬薄膜則反應殆盡，因此接合完成的熱電模組可以承受較傳統軟銲接合 模組更高的操作溫度，同時避免銲錫與電極接合界面反應所導致可靠度劣化問題。本計畫另一重點在於熱電模組界面反應障礙層研究，由於目前中鋼熱電模組封裝界面反應障礙層採用電鍍鎳，長時間高溫操作鎳反應層將會消耗，導致界面反應障礙層失效，熱電模組損壞，本計畫將尋找其他適當的界面反應障礙層，尤其將嘗試使用「金屬玻璃」 作為熱電模組界面反應障礙層，藉著金屬玻璃的低擴散係數特性，延長熱電模組壽命。本計畫之熱電材料包括中鋼公司目前已在連續鑄造爐及鋼板滾軋加熱爐廢熱回收之Bi3Te2低溫熱電材料及中鋼公司正積極發展的PbTe中溫熱電材料，同時考量Te元素的高成本與毒性，亦涵蓋兼具環保與低成本優點的Zn3Sb4 中溫熱電材料。 本計畫對國內社會、經濟及產業發展的意義包含3個層面：1.開發熱電材料應用技術作為新的替代能源，2.經由工業廢熱回收減少能源消耗達到節能目的，3. 廢熱回收再運用以降低產業活動對環境的衝擊。<br> Abstract: Packaging Technology for High Reliability Thermoelectric Modules The effort of this study has been concerned with the increase of reliability of medium and low temperature thermoelectric modules applied in Chinal steel Co. LTD for the recycling of industrial waste heat. At present, the soldering method hase been used for the manufacturing of thermoelectric modules. This traditional soldering method for the bonding of a TE device with electrodes has the disadvantage that the operation temperature of the finished TE modulus is limited by the melting point of the solder alloy used. In addition, the interfacial reactions between solder alloy and electrodes will also cause the degradation of reliability. A new method of “solid liquid interdiffusion bonding” will be adopted in this study for the packaging of the TE modulus. This technique uses a low melting point metallic film such as Sn, In, or In-Sn with a thickness of several micrometers to react with a Ag layer deposited on both the TE device and the metallic electrode. The result is a Ag3Sn intermetallic compound with a high melting point of 480℃, and the low melting point metallic thin film is exhausted during the interfacial reaction. The finished TE modulus can endure much higher temperature than one manufactured with the traditional soldering method, and the reliability degradation resulted from solder/electrode interfacial reactionscan be prevented. Another keypoint of research in this project is the development of a high reliability diffusion barrier for the bonding of thermoelectric materials and metallic electrodes. The electroplating Ni film has been used as the barrier layer, which can be consumed after long term application of the TE modules. Metallic glass has been considered as an optimized barrier layer material due to its low diffusivity. The thermoelectric materials in this study includes the Bi3Te2 low temperature TE and PbTe medium TE alloy systems, which have been well developed in China steel Co.. In addition, a low cost and environment friendly Zn3Sb4 material will also been employed in consideration of the toxicity and high cost of Te element in Bi3Te2 and PbTe. The contributions of the project for the domestic society, economic and industrial development are consisted with 3 levels: 1.developing the application technologies for thermoelectric materials as new substitutive energy resource, 2. reducing the energy exhaust through the recycling of producing waste heat, 3.Decreasing the environmental impact caused by industrial activities through the waste heat recycling.熱電模組金屬玻璃固液擴散接合工業廢熱回收Thermoelectric modulesmetallic glasssolid liquid interdiffusion bondingindustrial waste heat recycling