Chen, Sinn-WenSinn-WenChenYang, Ching-FengChing-FengYangHSIN-JAY WUChang, Ru-BoRu-BoChangHsu, Chia-MingChia-MingHsu2024-09-182024-09-182012https://www.scopus.com/record/display.uri?eid=2-s2.0-84856618469&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/721190Sn-In-Zn alloys are promising Pb-free solders. Their interfacial reactions with Ag and Ni substrates at 230 °C are experimentally determined using reaction couple techniques. The reaction path is liquid/Ag in the Sn-20 wt%In-x wt%Zn/Ag couple when the Zn content is less than 0.7 wt%, and the reaction path changes to liquid/ε-AgZn3/γ-Ag5Zn 8/-AgZn/Ag when the Zn content is 5 wt%Zn. The reaction path is liquid/Ni3Sn4/Ni when the Zn content is less than 1.0 wt%, and the reaction path becomes liquid/γ-Ni5Zn 21/(Ni3Sn4)/Ni when the Zn content is higher than 2.0 wt%. The reaction paths in both two kinds of couples are affected by the Zn addition. © 2011 Elsevier B.V. All rights reserved.Intermetallic compoundsMetalsPhase equilibriaPhase transitionsjournal article10.1016/j.matchemphys.2011.11.0572-s2.0-84856618469