Infrared joining of TiA1 intermetallics using Ti-15Cu-15Ni foil - II. The microstructural evolution at high temperature

Lee, S.J.S.J.LeeWu, S.K.S.K.WuLin, R.Y.R.Y.LinSHYI-KAAN WU2018-09-102018-09-101998http://www.scopus.com/inward/record.url?eid=2-s2.0-0031988429&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/338433Infrared joining of TiA1 intermetallics using Ti-15Cu-15Ni foil - II. The microstructural evolution at high temperaturejournal article