Huang H.-HLEE-YIH WANG et al.2021-08-052021-08-05202125424351https://www.scopus.com/inward/record.uri?eid=2-s2.0-85104685291&doi=10.1016%2fj.joule.2021.02.012&partnerID=40&md5=179efe4970828098d037f10923eb408ahttps://scholars.lib.ntu.edu.tw/handle/123456789/577241The one-step antisolvent approach is a widely employed method for fabricating perovskite devices at a low cost. However, the current antisolvent approach requires a strict set of processing conditions to obtain high-quality perovskite layers. Here, we introduce sulfolane as an additive in the perovskite precursor to convert the perovskite phase via a new reaction route, providing a large degree of flexibility to process crystalline perovskite layers with high uniformity on a large scale. As it is revealed by X-ray diffraction and Fourier-transform infrared spectroscopy findings, we find that the key concept lies in intermolecular hydrogen-bonding forces’ interaction between sulfolane and methylammonium iodide, which slows down the nucleation and subsequently the crystallization process. As a result, we demonstrate a mini module, 36.6 cm2 active area, and achieve a record PCE of 16.06%. More importantly, the encapsulated mini module retained about 90% of the initial performance after operating at the maximum power point under simulated AM1.5G irradiation for 250 h at 50°C. ? 2021Fabrication; Fourier transform infrared spectroscopy; Hydrogen bonds; Crystallization process; Degree of flexibility; Intermolecular hydrogen bonding; Maximum power point; Module fabrication; Perovskite layers; Processing condition; Processing windows; Perovskite; additive; chemical reaction; perovskite; photovoltaic system[SDGs]SDG7Fabrication; Fourier transform infrared spectroscopy; Hydrogen bonds; Crystallization process; Degree of flexibility; Intermolecular hydrogen bonding; Maximum power point; Module fabrication; Perovskite layers; Processing condition; Processing windows; Perovskite; additive; chemical reaction; perovskite; photovoltaic systemjournal article10.1016/j.joule.2021.02.0122-s2.0-85104685291