莊東漢2006-07-252018-06-282006-07-252018-06-282001http://ntur.lib.ntu.edu.tw//handle/246246/12396本計畫針對要求60dB 以上高級電磁屏蔽效率材料之電子資訊產品外殼製造,尤其鎖定在國內即將躍居世界第一位並將佔有全球一半以上市場的筆記型電腦產業。將利用金屬的超塑性成型技術與塑膠成型技術發展成一創新之複合加工方法，主要製程技術 分成兩種：1.金屬薄片超塑性成型再進行塑膠射出成型，以得到一單面襯附金屬薄片之塑膠外殼。2.兩片塑膠內夾超塑性金屬薄片同步吹製成型，以得到一塑膠包夾金屬薄片之三明治結構外殼;所採用之超塑性金屬薄片均為價格低廉的鋅鋁合金;此產品/技術之最大特色在於可同時保有金屬的優異電磁屏蔽效果與塑膠的輕量及精巧細緻外形，另外亦具設備及材料成本低、亦回收且無大氣或廢水污染等多重優點。This study focuses on the novel processing of making electromagnetic interference (EMI) shielding enclosures specifically for the portable personal computers (PC) with typical requirements of low cost, lightweight, moderate production rate, fine surface finishing and EMI shielding effectiveness in excess of 60 dB. This subprogram will cooperatively work with other subprograms and apply the collective output of the team efforts to develop a complete package of processing technologies for the mass production of portable PC enclosures. The novel processing utilizes and the combined superplastic forming / thermogorming technique underdeveloped by the subprogram I. and the combined superplastic forming/injection molding technique underdeveloped by the subprogram II. The thin superplastic forming/theromolding processing is a low temperature high strain rate Zn-22% Al alloy to be developed and supplied by the subprogram III.application/pdf677590 bytesapplication/pdfzh-TW國立臺灣大學材料科學與工程學研究所電磁屏蔽鋅鋁合金超塑性成型塑膠熱塑加工筆記型電腦外殼Enclosures for portable PCZn-Al alloySuperplastic formingThermo-formingInjection moldingreporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/12396/1/892622E002011.pdf