2018-12-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/674391摘要：新一代功率模組如電動車、航太等產業將逐漸朝更高功率和工作溫度發展。在過去數十年，寬能帶半導體材料已被證實在高溫300°C以上具有優異之性質，然而，常見之封裝材料如錫基焊料之最高使用溫度不到200°C。因此，學者及業界積極開發各種封裝技術，使其接點能夠應用在高溫高功率模組中。銀膠或銅膠燒結技術在近年來被視為極具潛力之功率模組封裝技術，但是根據文獻報導，燒結銀與燒結銅接點仍有一些嚴重的問題需要克服，例如：高孔洞率、界面潤濕性差、高溫基板氧化問題，以及銀在含硫氣氛中硫化的問題等。這些問題皆會導致高溫高功率應用下接點之可靠度劣化。 本計劃目標為開發在高溫高功率下具有可靠度及良好性質之封裝技術，以提供新一代功率模組封裝技術之需求。我們提出之技術將銦引入燒結奈米銀膠中，結合銀銦暫液態接合和燒結奈米銀兩者技術的優點，開發一個低溫、低壓、短時間之接合技術。由過去結果更發現燒結銀銦接點具有低孔洞率、界面潤濕性佳、300°C下優異的抗氧化能力，和具有良好機械性質之潛力，因此燒結銀銦接合技術在新一代功率模組中將具有極大之可行性，此計畫將會進行深入探討。本計畫第一年將會評估銦添加方式和基板潤濕層材料選擇，並且探討接合溫度、壓力及時間參數對接點微結構和接合品質之影響，以進行製程之優化。第二年將建立接點在高溫熱儲藏下之微結構演變、介金屬成長及相變態動力學，並且進行燒結銀銦接合製程及接點抗氧化性質之分析，與剪應力強度和延展性等機械性質量測。第三年進行接點之可靠度測試，主要為高溫高功率模組相當關鍵的溫度循環試驗、抗硫化試驗及電化學遷移試驗，以評估此技術在接近實際應用環境下之可行性。透過本計劃，將建立一在高溫高功率下可靠之封裝技術及此技術完整性質與可靠度之評估。 <br> Abstract: Next generation power semiconductor modules for electric vehicles, aerospace, and other industries require higher power and higher service temperature. In the past decades, wide bandgap semiconductor devices have been demonstrated to operate successfully at temperature above 300°C. However, the most widely used packaging materials, like tin-based solders, are constrained to an operation temperature less than 200°C. Thus, researchers have been seeking various methods to achieve high temperature joints that can be utilized in new generation power modules. Sintered silver or copper paste has been considered as a promising technique, but critical issues have recently been identified in sintered joints as follows: high porosity, poor interfacial wettability, substrate oxidation, and the tarnishing issue of silver in sulfur-containing gases, all leading to poor reliability. The objective of this study is to develop a reliable packaging technology that can suit the next generation power modules. We introduced indium into nano-silver paste sintering to incorporate the advantages of silver-indium transient liquid phase bonding and nano-silver paste sintering. This technology features low temperature, low pressure, and short time during the bonding process. Furthermore, the assembled joint has exhibited the merits of low porosity, excellent interfacial wettability, outstanding anti-oxidation property at 300°C, and the potential of excellent mechanical properties in our previous study. Therefore, the sintered silver-indium bonding technology is quite promising for new generation power modules, and will be fully discussed in the proposed study. In the first year of the proposed study, the best method of introducing indium and the wetting layer on substrate will be chosen by evaluating the microstructure and bonding quality of assembled joints. Besides, the effect of bonding temperature, pressure and time on the assembled joints will also be discussed and further optimized for the industrial needs. The objective of this year is to optimize both the materials and bonding process in this technology. In the second year, the microstructure, interfacial reaction and phase transformation kinetics during high temperature storage of both sintered nano-silver joints and sintered silver-indium joints will be analyzed. The bonding mechanism and the evolution of the joint after high temperature will then be established. The anti-oxidation property of sintered silver-indium joint and its mechanism are also studied. In addition, mechanical properties like die shear strength and ductility of both sintered nano-silver joints and sintered silver-indium joints will also be assessed. The objective of this year is to evaluate the high temperature reliability and mechanical properties of the joints with and without indium. In the third year, more aspects of reliability tests that are extremely crucial for high power and high temperature applications are evaluated, such as temperature cycling test, anti-tarnishing test and electrochemical migration test, in order to verify the feasibility of the proposed technology during practical applications. Upon the completion of the proposed study, a reliable packaging technology that can truly exhibit excellent properties at high temperature and high power modules will be developed. In addition, the database concerning the bonding mechanism, overall properties and reliability performance of the assembled joints will be established.耐高溫封裝材料高功率模組晶片接合技術奈米銀膠燒結銀銦暫液態接合銦 添加抗氧化性質抗硫化性質High temperature packaging materialhigh power module die attachment technologynano-silver paste sinteringsilver-indium transient liquid phase bondingindium additionanti-oxidation propertyanti-tarnishing property