鄭鴻祥臺灣大學：電子工程學研究所林瑞龍Lin, Ruei-LongRuei-LongLin2007-11-272018-07-102007-11-272018-07-102006http://ntur.lib.ntu.edu.tw//handle/246246/57273近年來,紅外光偵測器發展普遍,在軍事上、醫學上、以及天文學上等等具有很大的貢獻。而隨著元件尺寸的縮小，積體電路的發展之下，以矽鍺(IV-IV族)為材料的元件，更是被高度重視著。本篇論文重心，以矽鍺材料為主，製作出矽鍺/矽異質接面內部光發射(HIP)紅外光偵測器，此偵測器有許多優勢，例如有良好的均勻性、對垂直入射光有較好的靈敏度，較高的響應度，以及容易與電路作整合。 除此之外，近幾年來以絕緣層上覆矽(SOI)的技術，應用在金屬-氧化物-半導體(MOS)元件上有良好的操作特性，例如降低漏電流、較少的寄生電容、低功率和高速元件等等。 因此，欲結合上述之優勢，矽鍺/矽異質接面內部光發射紅外光偵測器成長在絕緣層上覆矽已被成功製作出，並著重以傅氏紅外線光譜儀來量測其結構的紅外光之吸收特性。Recently, infrared detectors provide greatest contributions and functions in military, medical and astronomy. In order to integrability with the readout circuitry, we think highly of the devices mainly fabricated by SiGe. And the Si1-xGex/Si heterojunction internal photoemission (HIP) infrared photodetectors have many advantages, such as excellent uniformity, sensitivity to normally incident radiation, higher responsivity and easier integration with readout circuitry. Besides, silicon-on-insulator (SOI) technology has been used in CMOS application in recent years, and it have many advantages, such as low leakage-current, low parasitic capacitances, low power and high speed. In this thesis, SiGe/Si heterojunction internal photoemission infrared photodetector has been fabricated on SOI wafer. The infrared characteristics of the structure are measured by Fourier Transform Infrared (FTIR) spectrometer.Chinese Abstract … i English Abstract … ii Acknowledgement … iii Content … iv Chapter1 : Introduction … 1 1.1 Motivation … 1 1.2 The effect of strain on SiGe alloy … 3 1.3 Relaxation … 5 1.4 Band gap of strain effect on SiGe alloy … 7 Reference … 11 Chapter2 : Background of SiGe/Si Heterojunction Internal Photoemission Infrared Photodetector … 13 2.1 Blackbody Radiation … 13 2.2 Atmospheric Infrared Absorption … 14 2.3 Infrared Detector … 15 2.4 Heterojunction Internal Photoemission Infrared Photodetector … 19 Reference … 22 Chapter3 : Fabrication of Device … 23 3.1 Sample structure … 23 3.2 Molecular Beam Epitaxial (MBE) Growth … 24 3.3 Process of Sample … 28 Reference … 34 Chapter4 : Measurement Principle and Experiment Setup … 35 4.1 FTIR Measurement … 35 4.2 Raman Measurement … 43 4.3 Current-voltage Measurement … 45 Reference … 47 Chapter5 : Results and Discussions … 48 5.1 FTIR Measurement … 48 5.2 Raman Measurement … 56 5.3 Current-voltage Measurement … 59 5.4 Conclusions … 62 Reference … 631261994 bytesapplication/pdfen-US矽鍺矽鍺異質接面紅外光偵測器SiGeSiGeheterojunctioninfrareddetectorthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/57273/1/ntu-95-R93943158-1.pdf