Suwandana R.F., Hsieh Y.-P., Hofmann M.Hsieh Y.-P., Hofmann M.Suwandana R.F.Mario Hofmann2021-07-282021-07-2820202555476https://www.scopus.com/inward/record.uri?eid=2-s2.0-85085184793&partnerID=40&md5=7012fb30bd955b68cab669c122dccf77https://scholars.lib.ntu.edu.tw/handle/123456789/573718The assembly of graphene and other two-dimensional (2D) materials into artificial crystals termed van-der-Waals stacks has great potential to produce new materials without precedence in nature and develop novel electronic devices. To reliably assemble 2D materials into such structures, however, a better understanding of the transfer process is required. Here we report a quantitative approach to examining the adhesion behavior during viscoelastic stamping of 2D materials. By measuring the adhesion of graphene to different carrier substrates and varying the peeling speed we have identified the range of adhesion of samples. The result shows that the adhesion occurs between graphene-graphene and graphene-SiO2 substrate have a higher value than the ability of polydimethylsiloxane (PDMS) stamp to pick up. The impact of surface modification and alternative substrates is investigated and our results provide guidelines to realize an effective fabrication method for two-dimensional heterostructure devices. ? 2020 Trans Tech Publications Ltd, Switzerland.Adhesion; Polydimethylsiloxane; Silica; Silicones; Stamping; Substrates; Van der Waals forces; Viscoelasticity; Adhesion behaviors; Alternative substrates; Fabrication method; Heterostructure devices; Polydimethylsiloxane stamps; Quantitative approach; Stamping technique; Two Dimensional (2 D); Grapheneconference paper2-s2.0-85085184793