Sung H.-W.Cheng W.-H.ING-SH CHIUHsu H.-L.Liu S.-A.2020-03-122020-03-1219960021-9304https://www.scopus.com/inward/record.uri?eid=2-s2.0-0030249427&doi=10.1002%2f%28SICI%291097-4636%28199623%2933%3a3%3c177%3a%3aAID-JBM7%3e3.0.CO%3b2-N&partnerID=40&md5=9e2cb4a3dce50084c326c1f9327cd219https://scholars.lib.ntu.edu.tw/handle/123456789/475706Studies on epoxy compound fixationjournal article10.1002/(SICI)1097-4636(199623)33:3<17788648892-s2.0-0030249427