TSV-aware analytical placement for 3-D IC designs based on a novel weighted-average wirelength model

Hsu, M.-K.M.-K.HsuBalabanov, V.V.BalabanovYAO-WEN CHANG2018-09-102018-09-102013http://www.scopus.com/inward/record.url?eid=2-s2.0-84875145087&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/380146[SDGs]SDG16TSV-aware analytical placement for 3-D IC designs based on a novel weighted-average wirelength modeljournal article10.1109/TCAD.2012.22265842-s2.0-84875145087WOS:000317001200003