The design of rapid thermal process for large diameter applications [semiconductor wafer processing]

Dept. of Electr. Eng., National Taiwan Univ.Liu, C.W.C.W.LiuLee, M.H.M.H.LeeChao, C.Y.C.Y.ChaoChen, C.Y.C.Y.ChenYang, C.C.C.C.YangChang, Y.Y.ChangCHEE-WEE LIUCHIH-CHUNG YANG2007-04-192018-07-062007-04-192018-07-061998-06http://ntur.lib.ntu.edu.tw//handle/246246/2007041910021711application/pdf599068 bytesapplication/pdfen-USThe design of rapid thermal process for large diameter applications [semiconductor wafer processing]journal article10.1109/SMTW.1998.722653http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910021711/1/00722653.pdf