Chiu Y.S.C. ROBERT KAO2019-11-272019-11-272018978153864998505695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-85051920422&doi=10.1109%2fECTC.2018.00137&partnerID=40&md5=a3e44d9a4bd0829b757008dd5b349d5fhttps://scholars.lib.ntu.edu.tw/handle/123456789/432574[SDGs]SDG7Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusionconference paper10.1109/ECTC.2018.001372-s2.0-85051920422